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Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

Categories Hybrid Integrated Circuit Package
Brand Name: JOPTEC
Place of Origin: HEFEI, CHINA
MOQ: 50 PCS
Payment Terms: T/T
Supply Ability: 5000000 PCS/Month
Delivery Time: 30 Days
Packaging Details: Boxes
Types of Ceramic: Aluminum Nitride AlN
Flatness of chip mounting area: ≤ 2 um
Roughness of chip mounting area: ≤ 0.3 um
Plating thickness: Ni (2-5um)
Water flow: ≥ 300ml/min
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Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

Technical characteristics:


Micro channel heat sink

Flatness of chip mounting area ≤ 2 um

Roughness of chip mounting area ≤ 0.3 um

Plating thickness: Ni (2-5um)

Au (0.05-0.15um)

Water flow ≥ 300ml/min


High thermal conductivity aluminum nitride ceramic heat sink

Types of Ceramic: Aluminum Nitride AlN

Thermal conductivity: 200 W/m.K

Roughness of metallized area: Ra 0.5um Max

Flatness of metallized area: 5um Max

Copper thickness accuracy: 75±10 um

Preset gold tin solder: Au (75±5wt%) Sn

Quality Gold Plating SMD Ceramic Hybrid Integrated Circuit Package for sale
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