Categories | Hybrid Integrated Circuit Package |
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Brand Name: | JOPTEC |
Place of Origin: | HEFEI, CHINA |
MOQ: | 50 PCS |
Payment Terms: | T/T |
Supply Ability: | 5000000 PCS/Month |
Delivery Time: | 30 Days |
Packaging Details: | Boxes |
Types of Ceramic: | Aluminum Nitride AlN |
Flatness of chip mounting area: | ≤ 2 um |
Roughness of chip mounting area: | ≤ 0.3 um |
Plating thickness: | Ni (2-5um) |
Water flow: | ≥ 300ml/min |
Technical characteristics:
Micro channel heat sink
Flatness of chip mounting area ≤ 2 um
Roughness of chip mounting area ≤ 0.3 um
Plating thickness: Ni (2-5um)
Au (0.05-0.15um)
Water flow ≥ 300ml/min
High thermal conductivity aluminum nitride ceramic heat sink
Types of Ceramic: Aluminum Nitride AlN
Thermal conductivity: 200 W/m.K
Roughness of metallized area: Ra 0.5um Max
Flatness of metallized area: 5um Max
Copper thickness accuracy: 75±10 um
Preset gold tin solder: Au (75±5wt%) Sn