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Synthetic Stone and Durostone SMT Process Carriers Tin Furnace Fixture

Categories Reflow Wave Solder Pallets
Place of Origin: Dongguan
Brand Name: SMTfly
Certification: CE ISO
Model Number: CWSP-R1
MOQ: 1Set
Packaging Details: each set be packed in carton
Delivery Time: 1-3 days after payment confirm
Payment Terms: TT in advance
Supply Ability: 300 sets per month
Price: RMB/USD
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Synthetic Stone and Durostone SMT Process Carriers Tin Furnace Fixture


Synthetic Stone and Durostone SMT Process Carriers Tin Furnace Fixture

Features and Benefits

Wave solder pallets offer many advantages to the cost conscious Process Engineer. These advantages can usually pay back in a few weeks with cost savings and improved yields. By deploying a double reflow process, you can maximize your yields through the wave solder process.

Other advantages are:


1 Eliminate flooding by masking open areas and preventing board sag.
2 Reduce second hand load parts and hand soldering.
3 Save thousands of dollars in Kapton tape and the labor to add and remove.
4 The composite materials thermally protect bottom side SMD’s from shock.
5 Mask BGA vias from the wave ensuring reliable solder joints.
6 Lead Free grade optical material for higher temperatures


Specification:


ModelDurostoneCHP760DurostoneCAS761DurostoneCAG762
GradeStandardAnti-StaticAnti-static(Optical)
ColourBlueBlackGrey
Density(g/mm3)1.851.851.85
Standard OperationTemperature260260260
Maximum Operation Temperature(C)350350350
Sheet Size(mm)2440×12202440×12202440×1220
Tickness/weight(mm/kg)3/17, 4/225/28, 6/33, 8/4410/55, 12/66

BOTTOM SIDE STANDARD FEATURES


All bottom side fasteners are made from 316 grade stainless steel. This eliminates solder sticking or wetting to the fastener.


All fasteners are thread locked.

Our goal is to design and build a solution that will give you:


1. Highest yields with the largest process window possible.
2. Easy to use tooling that will survive your manufacturing environment.
3. Fastest delivery times possible.

Process Suitability


The viability of this process route crucially relies upon being able to estimate the number and distribution of PTH components

which CAN'T be processed (with and without glue dotting) - These will have to be miniwaved or hand soldered.
which are likely to be poorly soldered - These will require further inspection and manual touch up.


This estimation may be done in three ways

If a PCB is available (preferably populated) - our sales engineers can rapidly evaluate your board.
If PCB design data is available we will process, analyse and remotely assess it.
You can do it using the rules presented below - our customers quickly find that the above two methods are easiest.


Gerber, Excellon and other data required

Pin Land to SMT pad clearance evaluation

The two figures below each show part of a CSWSC in plan and section views. The right hand figure shows that more clearance
is required when the connector orientation is perpendicular to the wave.

PTH Components Located Parallel to direction through wave

The clearance required between the pin land and SMT pad can be made quite
small, as the solder does not have to flow "under" the component pockets.

PTH Components Located Perpendicular to direction through wave.

A larger separation is required due to the solder having to flow "under"
component pockets.

Working your way around the underside of the PCB, identify which components
are parallel and perpendicular to the wave and assess the solderability of each
PTH connector by comparing the actual separation against the graph right.

Ideally you want to be above the line in all cases.

PCB Design Implications - for Board Designers - or respin

We are often called upon by our customers to help with identifying design respin opportunities.

We will identify problem areas within a board and suggest appropriate movements of components. (Ideally before the PCB is fabricated)

However for board designers reading this, can you remember another four "rules" (to compete with the hundred other rules you have to have floating
around in your head).

Keep large (height) SMT components away from PTH areas.
Leave the leading and trailing areas around PTH components as clear as possible.
DON'T put any SMT components within 3mm (0.12") of any PTH components.
DON'T put all PTH components in line along one edge of a board - leave some space to allow us to support the masking in the centre of the board.

Our production flow


CE approval

Clients from electronic industry.


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