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...precision PCBs with the principle of “the Best quality, the lowest price and the promptest delivery” Manufacture PCB board up to 48 layer, Raw material: Fr4, Rogers, Arlon, Teflon, Taconic, Nelco, Isola, Ceramic, Metal core Support PCB surface process:
...precision PCBs with the principle of “the Best quality, the lowest price and the promptest delivery” Manufacture PCB board up to 48 layer, Raw material: Fr4, Rogers, Arlon, Teflon, Taconic, Nelco, Isola, Ceramic, Metal core Support PCB surface process: more
Brand Name:FASTPCBA
Model Number:Bga Pcb Assembly
Place of Origin:China
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Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ...
Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehensively, promote the digitization, ... more
Brand Name:FASTPCB
Place of Origin:CHINA
Minimum Order Quantity:10PCS
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New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ...
New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved ◆ IC Programming ◆ BGA rework ◆ Chip on Board/COB ◆ Eutectic soldering ◆ Auto-Gluing ◆ Conformal Coating Assemly Flow Chart: ... more
Brand Name:Suntek
Model Number:FPA8569-NE4
Place of Origin:China
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... footprint technologies. From standard FPGAs to complex Micro-BGAs (0.2mm pitch) and Package-on-Package (PoP) stacking, we possess the equipment and process maturity to ensure reliable interconnections. The challenge with BGA technology is visibility.
... footprint technologies. From standard FPGAs to complex Micro-BGAs (0.2mm pitch) and Package-on-Package (PoP) stacking, we possess the equipment and process maturity to ensure reliable interconnections. The challenge with BGA technology is visibility. more
Brand Name:Dux PCB
Model Number:BGA Assembly
Place of Origin:China
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...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the
...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the more
Brand Name:Shinelink
Model Number:SL0925S01
Place of Origin:China
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...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on
...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on more
Brand Name:Bicheng
Model Number:BIC-462.V1.0
Place of Origin:CHINA
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...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on
...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on more
Brand Name:Bicheng Technologies Limited
Model Number:BIC-462-V7.8
Place of Origin:China
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...Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly...
...Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly... more
Brand Name:UNICOMP
Model Number:AX9100max
Place of Origin:China
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... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the design of extremely compact applications. Since
... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the design of extremely compact applications. Since more
Brand Name:TELIT
Model Number:GL865-QUAD
Place of Origin:China
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Ball Grid Array (BGA) 63164-136T Take Your Business to the Next Level with Contactor and Durable Product Description: A contactor is an essential component in electrical systems that are used to control the flow of electricity. It is a type of contact ...
Ball Grid Array (BGA) 63164-136T Take Your Business to the Next Level with Contactor and Durable Product Description: A contactor is an essential component in electrical systems that are used to control the flow of electricity. It is a type of contact ... more
Model Number:Ball Grid Array (BGA) 63164-136T
Minimum Order Quantity:1
Price:Negotiable
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OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ...
OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the components on the PCBA to determine the delivery ... more
Brand Name:HNL-PCBA
Model Number:Rapid PCBA
Place of Origin:CHINA
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Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our...
Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. Along with more than 10 years′ development, our... more
Brand Name:YDY
Model Number:E-002
Place of Origin:China
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XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ...
XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a range of components, such as a central ... more
Brand Name:XILINX
Model Number:XC6SLX16-2FTG256C
Place of Origin:TW
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Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as phones, tablets, and other portable gadgets. Engineered with precision and reliability in mind, this EMMC ...
Product Description: The EMMC Memory Card is a high-performance storage solution designed to meet the demands of modern electronic devices such as phones, tablets, and other portable gadgets. Engineered with precision and reliability in mind, this EMMC ... more
Bus Width:1-bit, 4-bit, 8-bit
Product Completion:Standard
Capacity:8gb/ 16gb/ 32gb/ 64gb/ 128gb/ 256gb
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...PCB Assembly Smd Electronics PTEF Technical capabilities: -PCBA Capacity Single and double-sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch 0.008 in. (0.2 mm) Max Parts size assembly by machine 2.2 in. x 2.2 in. x 0.6 in. Assembly...
...PCB Assembly Smd Electronics PTEF Technical capabilities: -PCBA Capacity Single and double-sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch 0.008 in. (0.2 mm) Max Parts size assembly by machine 2.2 in. x 2.2 in. x 0.6 in. Assembly... more
Brand Name:ABIS
Model Number:H-PCB2
Place of Origin:China
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...Substrate LED Pcb sheet information: four layers FR4, plate thickness 1.0MM, copper thickness 10Z, sinking gold, minimum hole 0.2MM Dielectric: FR-4 Flame retardant performance: V0 Package form: fine pitch ball grid array packaging technology Product Name:
...Substrate LED Pcb sheet information: four layers FR4, plate thickness 1.0MM, copper thickness 10Z, sinking gold, minimum hole 0.2MM Dielectric: FR-4 Flame retardant performance: V0 Package form: fine pitch ball grid array packaging technology Product Name: more
Brand Name:Yizhuo
Model Number:Aluminum Pcb Board 01
Place of Origin:China
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...training. We have a production capability for standard and HDI ,Rigid, RF and high frequency PCBs, together with through hole and min 0201 chips, 0.2mm pitch BGA balls SMD soldering, in small batch, mid volume and high volume quantities. High professional:
...training. We have a production capability for standard and HDI ,Rigid, RF and high frequency PCBs, together with through hole and min 0201 chips, 0.2mm pitch BGA balls SMD soldering, in small batch, mid volume and high volume quantities. High professional: more
Brand Name:FASTPCBA
Model Number:PCBA Manufacturers
Place of Origin:China
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... capability for standard and HDI ,Rigid, RF and high frequency PCBs, together with through hole and min 0201 chips, 0.2mm pitch BGA balls SMD soldering, in small batch, mid volume and high volume quantities. SHINELINK, your single point of contact for all
... capability for standard and HDI ,Rigid, RF and high frequency PCBs, together with through hole and min 0201 chips, 0.2mm pitch BGA balls SMD soldering, in small batch, mid volume and high volume quantities. SHINELINK, your single point of contact for all more
Brand Name:OEM/ODM
Model Number:SL01116S01
Place of Origin:China
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...pcb prototype and assembly pcba production PCBA Production Capabilities SMT Line 5 lines Capacity: 7 million Placements per Day Maximum PCB size: 700x 460mm Minimum chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum) Assembly...
...pcb prototype and assembly pcba production PCBA Production Capabilities SMT Line 5 lines Capacity: 7 million Placements per Day Maximum PCB size: 700x 460mm Minimum chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum) Assembly... more
Brand Name:HighLeap
Model Number:PCBA
Place of Origin:China
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... Standard chip size component: 0603 and larger Component max height:15mm Min lead pitch: 0.3mm Min BGA ball pitch:0.4mm Placement precision: +/-0.03mm Model Number:
... Standard chip size component: 0603 and larger Component max height:15mm Min lead pitch: 0.3mm Min BGA ball pitch:0.4mm Placement precision: +/-0.03mm Model Number: more
Brand Name:BQZYX+
Model Number:ZYX-217QWERT
Place of Origin:China
