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Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,...
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.3mm; Material brand:Mainly brand:SHENGYI,... more
Brand Name:Horexs
Place of Origin:china
Certification:UL
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...
2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ... more
Brand Name:China chao sheng
Model Number:2 layers of COF
Place of Origin:Shenzhen, Guangdong, China
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...
... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ... more
Brand Name:NEWFILM
Model Number:NF-019
Place of Origin:China, Guangzhou
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...
Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ... more
Brand Name:TECircuit
Model Number:TEC0211
Place of Origin:China
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... CUF (Capillary Underfill) dispensing tasks in advanced semiconductor packaging, including FCBGA, FCCSP, and SiP modules. The GS600 series combines a piezoelectric jetting valve with six integrated process modules, which ensures steady flow ...
... CUF (Capillary Underfill) dispensing tasks in advanced semiconductor packaging, including FCBGA, FCCSP, and SiP modules. The GS600 series combines a piezoelectric jetting valve with six integrated process modules, which ensures steady flow ... more
Brand Name:Mingseal
Model Number:GS600SU/SUA
Place of Origin:China
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... Circuits AM2432BSEFHIALXR FCCSP-293 Microcontrollers - MCU Specifications Product Attribute Attribute Value Manufacturer: Texas Instruments Product Category: ARM Microcontrollers - MCU Series: AM2432 Mounting Style: SMD/SMT Package / Case: FCCSP-293 Core...
... Circuits AM2432BSEFHIALXR FCCSP-293 Microcontrollers - MCU Specifications Product Attribute Attribute Value Manufacturer: Texas Instruments Product Category: ARM Microcontrollers - MCU Series: AM2432 Mounting Style: SMD/SMT Package / Case: FCCSP-293 Core... more
Mfr. #:AM2432BSEFHIALXR
Mfr.:Texas Instruments
Description:ARM Microcontrollers - MCU Dual-core Arm Cortex-R5F-based MCU with industrial communications and security up to 800 MHz
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... Cortex M4F Number of cores: 2 Core Data bus width: 64 bit Maximum clock frequency: 400 MHz Package/Case: FCCSP-425 Series: AM625 Installation style: SMD/SMT Minimum operating temperature: - 40 C Maximum operating temperature: +105 C
... Cortex M4F Number of cores: 2 Core Data bus width: 64 bit Maximum clock frequency: 400 MHz Package/Case: FCCSP-425 Series: AM625 Installation style: SMD/SMT Minimum operating temperature: - 40 C Maximum operating temperature: +105 C more
Brand Name:Texas Instruments
Model Number:AM6252ATCGHAALW
Place of Origin:USA
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TX08DACP Wireless Communication Module 8-Channel Ultrasound Transmitter FCCSP-196 Package [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + 100% ...
TX08DACP Wireless Communication Module 8-Channel Ultrasound Transmitter FCCSP-196 Package [MJD Advantage] + 15 years experience for electronic components + Secure Ordering + Excellent Feedback + Delivery Date Guaranteed + 100% ... more
Brand Name:Original Factory
Model Number:TX08DACP
Place of Origin:CN
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TMS320C6203BGNY300 FCCSP-384 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching performance Product Technical ...
TMS320C6203BGNY300 FCCSP-384 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching performance Product Technical ... more
Brand Name:Original Factory
Model Number:TMS320C6203BGNY300
Place of Origin:China
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Introducing the newly shipped RF PCB.Which is built is built on 31mil rogers DiClad 870 substrates. Designed with a focus on achieving lower dielectric constants, the DiClad 870 PCB offers exceptional electrical properties for a wide range of applications...
Introducing the newly shipped RF PCB.Which is built is built on 31mil rogers DiClad 870 substrates. Designed with a focus on achieving lower dielectric constants, the DiClad 870 PCB offers exceptional electrical properties for a wide range of applications... more
Brand Name:Bicheng
Place of Origin:CHINA
Certification:UL, ISO9001, IATF16949
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Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT...
Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT... more
Brand Name:wuxi special ceramic
Place of Origin:China
Minimum Order Quantity:10p
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Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving...
Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving... more
Brand Name:ZMSH
Place of Origin:China
Minimum Order Quantity:1
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...ch makes it ideal for use in optics and other applications where transparency is important. The Sapphire Substrate comes in a package of 25/cassette, making it easy to handle and store. The substrate features a sapphire template layer and is oriented along
...ch makes it ideal for use in optics and other applications where transparency is important. The Sapphire Substrate comes in a package of 25/cassette, making it easy to handle and store. The substrate features a sapphire template layer and is oriented along more
Place of Origin:China
Minimum Order Quantity:100 pcs
Packaging Details:cassette
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GB / T1720 - 88 Manual or electric Operation Film Electric Adhesion Tester Equipment Description: Electric film adhesion tester, determination of Planning circular path through the film adhesion properties. To Yuangun line scratches integrity within the ...
GB / T1720 - 88 Manual or electric Operation Film Electric Adhesion Tester Equipment Description: Electric film adhesion tester, determination of Planning circular path through the film adhesion properties. To Yuangun line scratches integrity within the ... more
Brand Name:ZL
Model Number:ZL-2303
Place of Origin:China
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... efficient cutting mode; the maximum processing workpiece size is 150* 150mm, suitable for small packaging substrate materials, soft materials cutting, manual loading and unloading, automatic transmission and positioning, automatic alignment cutting. 1.The
... efficient cutting mode; the maximum processing workpiece size is 150* 150mm, suitable for small packaging substrate materials, soft materials cutting, manual loading and unloading, automatic transmission and positioning, automatic alignment cutting. 1.The more
Categories:PCB Depanelizer
Country/Region:china
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...MoCu30/Cu CPC Copper Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging 1. Information Of Cu/MoCu30/Cu CPC 1:4:1 Substrate For Microelectronic Packaging: Copper has high thermal and electrical conductivity and is easy to ...
...MoCu30/Cu CPC Copper Molybdenum Copper Alloy Substrate For Glass Adapter Plate Microelectronic Packaging 1. Information Of Cu/MoCu30/Cu CPC 1:4:1 Substrate For Microelectronic Packaging: Copper has high thermal and electrical conductivity and is easy to ... more
Brand Name:PRM
Model Number:CuMoCu
Place of Origin:China
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...Substrate Iron Metal Packaging Can Component 10L Round Industrial Chemical Paint Pail End Top Lid Pail Lid Material:Tinplate Usage: For metal can packaging Product Specification Parameter Value Cover Inner Diameter 233mm Depth 8mm Commond Material Tinplate/Substrate Iron Commond Thickness 0.28mm/0.32mm Commond Printing Process Single White Commond Peritoneal Process White Gold Film Packaging...
...Substrate Iron Metal Packaging Can Component 10L Round Industrial Chemical Paint Pail End Top Lid Pail Lid Material:Tinplate Usage: For metal can packaging Product Specification Parameter Value Cover Inner Diameter 233mm Depth 8mm Commond Material Tinplate/Substrate Iron Commond Thickness 0.28mm/0.32mm Commond Printing Process Single White Commond Peritoneal Process White Gold Film Packaging... more
Brand Name:Delicacy
Model Number:TINPLATE
Place of Origin:CHINA
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...substrates like plastics, metal foils, and paper. It combines vacuum evaporation, sputtering, or plasma-enhanced techniques to create functional films for packaging, electronics, and renewable energy applications. Working Principle Continuous Substrate Handling: The substrate
...substrates like plastics, metal foils, and paper. It combines vacuum evaporation, sputtering, or plasma-enhanced techniques to create functional films for packaging, electronics, and renewable energy applications. Working Principle Continuous Substrate Handling: The substrate more
Brand Name:Lion King
Place of Origin:Guangdong
Minimum Order Quantity:1
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...substrate soil production line is an automated production system that integrates automatic loading, precise batching, efficient mixing, sterilization, and finished product packaging. It is designed for large-scale, high-efficiency, and high-quality production of various nutrient soils, cultivation substrates, seedling substrates...
...substrate soil production line is an automated production system that integrates automatic loading, precise batching, efficient mixing, sterilization, and finished product packaging. It is designed for large-scale, high-efficiency, and high-quality production of various nutrient soils, cultivation substrates, seedling substrates... more
Brand Name:Gofine
Model Number:GFP-1
Place of Origin:China
