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High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

Categories Thermal Epoxy Glue
Brand Name: Ziitek
Model Number: TIE380-25
Certification: RoHS
Place of Origin: China
MOQ: 10kg
Price: 1-100USD/kg
Payment Terms: T/T
Supply Ability: 10000kg/month
Delivery Time: 3-8 work days
Packaging Details: 1kg/can
material: epoxy glue
usage: bonding electronics
appearance sured: Dull Gray Solid
continuous use temp: -40 to 180℃
thermal conductivity: 2.5 W/mK
NAME: Thermal Epoxy Glue
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High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance

2022 high thermal conductivity thermal conductive epoxy glue good adhesive for bonding electronics


TIE™380-25High Performance Thermal Conductivity Of The Epoxy Adhesive


Product Summary:


TIE™380-25 is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling


Feature


Outstanding thermal performance 2.5W/mK
High tack surface reduces contact resistance
RoHS compliant
UL recognized
Fiberglass reinforced for puncture, shear and tear resistance
Easy release construction

Applications


Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices

Typical Properties of TIETM380-25


Chemical typeEpoxyTest Method
Appearance uncuredGray PasteVisual
Appearance curedDull Gray SolidVisual
ComponentsOne Component*****
Heat Capacity0.7 l/g-KASTM C351
Key SubstratesMetals, ceramics*****
Hardness92 Shore AASTM 2240
Continuous Use Temp-40 to 180℃*****
Tensile strength Al/Al @25°C>2800psi*****
Thermal Conductivity2.5 W/m-KASTM D5470

Application Features:TIE™380-25


Color Gray

Viscosity@25 140,000 cPs

Specific Gravity@25 2.1 g/cc

Shelf life @25° 10 Days

@0° 6 Months

(Storage methods and temperature will affect the shelf life)


Curing procedures:

Curing temperature Curing time

100° 3 Hours

125 1.5 Hour

150 20 Minutes

170 5 Minutes


Package:

1kg/can


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


Quality High Conductivity Thermal Epoxy Glue For Bonding Electronics Solvent Resistance for sale
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